*) These are modules that have lead-free external electrical connectors, but with internal high-lead solders as exempted by the RoHS STATUS RoHS – lead-free labels – Module Products 1, 2, 3, 4įor modules with various kinds of connectors *) (like screws, fast-on, solderable pins etc.) IXYS will apply this marking on the card boxes
#Ixys vuo 52 how to
How to discern easier between leaded and lead-free on IXYS products ? For discrete components IXYS will apply this marking on the card boxes and containers (according to JESD97) STATUS RoHS – lead-free labels - Discretes
#Ixys vuo 52 drivers
IXYS PWM controllers and MOSFET/IGBT Drivers Package TypeĨ-pin DIP 18-pin DIP 5 pin TO-263 Jul 1, 2004
TO-264 S TO-264 P TO-220 ISOPLUS/PLUS TO-247 ISOPLUS/PLUS TO-264 ISOPLUS/PLUS I4-PAK TO-3 METAL CAN STATUS RoHS – lead-free IXYS MOS & IGBT products Package Type Module Products 4 Outline Drawings # (IXYS short form catalogue 04/05) ¾ Schedule for the elimination of Cr6+ on washers and screws for modules VBO/VUO…NO8 VBO, VHF, VHO, VKO, VTO, VYK, VTOF, VVZF…io7 Module Products 3 Outline Drawings # (IXYS short form catalogue 04/05) Outline Drawings # (IXYS short form catalogue 04/05) VUO 52, VUB 72, VW2x …io1 Pin array (V2-Pack), VVZB120…io1 VUO/VUB, VWO…NO1/2 MMO, MLO…io1 CBI 1 ‘) DO-5 shims (supplied as accessory) will be RoHS compliant by Ma(Cr6+ replaced by Cr3+) Latest Date of Conversion to Pb-Free Terminals „SN“ means Pb-free terminals and RoHS complianceĭiscrete bipolar & Schottky products - 2 Label Identifier 1st, 2004 respectively type pure tin (e3) higher than - Jan. Latest Date of Pb-Free Date Terminal Conversion Label Identifier Codes finish *) to Pb-Free (yyww or yww) (JESD97) Terminals higher than suffix “SN” 0404 or 402 after/below part Feb. Mold compounds Laminates Solder resist Mold compounds Laminates coatings The limits refer to the individual material (such as mold compound, solder, plating, leadframe, substrate.) “ STATUS RoHS – lead-free Definition Green Package (common use in the industry) “The substances listed below are not intentionally added, but might be present as an impurity with an upper limit according to the listed values. However, there are exemptions listed in the Annex of RoHS : Among others: ¾ lead in high temperature melting type solders (like tin-lead solder alloys containing more than 85 % lead) This means that ¾ high lead die attach soft solders are not affected at all !! Waste Electrical and Electronic EquipmentĢ002/95/EC Restriction of the use of certain Hazardous Substances in electrical and electronic equipment under Article 4 „Prevention“ Clause 1 Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). ¾ EC Commission prepares an Integrated Product Policy (IPP) since 1997 WEEE 2000/53/EC onįramework for the Setting of Eco-Design Requirements for Energy Using ProductsĢ002/95/EC Restriction of Hazardous Substances
0 kommentar(er)
